Heat leaves the mold through planning, not luck.
Where base design and cooling meet
Channel depth eats into plate cross-section, so cooling plans written after the base is ordered often force compromises: shallower channels, awkward routing or added plates.
Manifold and connector clearance also claims real estate. Reserving space for them early keeps plates strong where they need to be.
FAQ
Who decides channel positions?
The mold designer owns the circuit, but the base supplier needs the envelope early. A simple channel map shared at order time prevents most clashes.
Does thicker plate solve cooling problems?
Thickness adds stiffness but can lengthen heat paths. The balance between strength and thermal response is a design decision, not a default.
What belongs in the base order notes?
Channel envelopes, connector clearances, and any lifting or sensor features. Clear notes at order time are cheaper than rework notes later.
All figures above refer to standard product data sheets; final confirmation is subject to written quotation.